Daisy Chain Test Vehicle

Daisy chain wafer, die, substrate and PCB

Glass Core Substrate

Glass core substate with 3um via, L/S 10/10um on 12 layers glass core substrate

Dummy glass substrate and silicon wafer

Glass panel of thickness 1.1mm, 0.5mm and silicon wafer to machine cycling, evaluation etc

Substrate, flex, PCB and FPC

Rigid organic substrate, flex, PCB and FPC for evaluation and production.

Ball Mount Equipment and AOI

High density ball mount equipment on strip and PCB. AOI to inspect missing ball

For enquires, pls drop email to admin@launchxtec.com

Wire bonding wires

Reliable and low cost wirebonding for Au, Cu, Ag, PdCu, Au plated Ag etc

Design Rules for your exploration