Upcoming Events

Inaugural seminar: “Next-Generation System Integration: Heterogeneous Integration and Hybrid Bonding”

The semiconductor industry in Singapore continues to grow rapidly, yet opportunities for technical networking and knowledge sharing remain limited. To address this gap, we are launching a new initiative — a Quarterly Technical Seminar Series — designed to serve as a platform for the local semiconductor ecosystem to exchange insights, share innovations, and foster collaboration.

The accelerating growth of Artificial Intelligence and its transformative applications, from large language models to complex autonomous systems, is rapidly driving the demand for unprecedented computational power. This surging demand, however, is increasingly bottlenecked by the constraints of traditional monolithic chip architectures and their limitations on data transmission and power efficiency. This seminar explores how Heterogeneous Integration (HI) provides the necessary architectural solution, with Hybrid Bonding serving as the revolutionary interconnect that achieves ultra-fine pitch, high-density, and high-speed links. Join us to learn from industry leaders to collaboratively shape the next generation of semiconductor technology.

Voltage Regulation Moving Into HI for HPC/AI

Hybrid Bonding - TBD

Panel Moderator - Packaging for AI

Speakers

Supporting Organisations & Sponsors

Chiplet & Heterogeneous Integration for Advanced Packaging       

(8-9 Jan 2026)

This comprehensive program covers the evolution from traditional IC packaging to chiplet-based and heterogeneous integration architectures, highlighting the market trends and technology drivers shaping modern electronics. Participants will delve into IC carriers and substrates as the foundation of multi-chip integration, gain hands-on understanding of 3D packaging and TSV processes for vertical stacking, and examine cutting-edge fan-out and panel-level packaging solutions. The workshop concludes with an exploration of emerging technologies—including hybrid bonding, glass core substrates, and advanced substrate architectures (2.1D–3.5D)—that are redefining performance, scalability, and design flexibility in semiconductor systems.

Interconnect Solutions for Chiplet and Heterogeneous Integration: Flip Chip, Thermocompression, and Hybrid Bonding

(22-23 Jan 2026)

Advance your understanding of next-generation semiconductor packaging with this comprehensive workshop on interconnect technologies. Beginning with the fundamentals of packaging performance and reliability, the program explores mechanical, thermal, electrical, and chemical design factors, as well as heterogeneous integration architectures such as SoC, SiP, and chiplets. Participants will gain in-depth knowledge of key bonding technologies—including Flip Chip (C4 and thermocompression), Thermocompression Bonding for fine-pitch applications, and Hybrid Bonding for sub-10 µm interconnects. Through detailed process insights, design considerations, and material innovations, this workshop equips engineers with the technical expertise to enhance performance, yield, and scalability in advanced packaging systems.

Glass Core Substrates for Advanced Packaging: Materials, Processes, and Integration

(5-6 Feb 2026)

Discover how glass substrates are redefining the future of advanced semiconductor packaging in this comprehensive workshop. Learn why glass is emerging as a superior alternative to silicon and organic materials, offering unmatched dimensional stability, low dielectric loss, and high flatness. The program covers material and performance advantages, key design rules, and fabrication processes such as through-glass via (TGV) formation, metallization, and redistribution layers. Participants will explore diverse applications—from HPC and AI accelerators to RF and photonics—along with insights into reliability testing, manufacturing challenges, and the evolving global supply chain. The workshop concludes with a forward-looking view on research directions, scalability, and the role of glass substrates in next-generation 3D and chiplet-based integration.

👉 Register now through the link below to secure your spot:

https://docs.google.com/forms/d/e/1FAIpQLSelNN7R6GP6hT0s3Udf_sTkXffqdneTkdiTOVPfc6FJ-TH1tw/viewform?usp=publish-editor

Upcoming Workshops in Singapore